Invention Grant
- Patent Title: Computational model and three-dimensional (3D) printing methods
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Application No.: US15127739Application Date: 2014-04-30
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Publication No.: US10471698B2Publication Date: 2019-11-12
- Inventor: Keshava A. Prasad , David H. Donovan , Krzysztof Nauka , Ali Emamjomeh , Hua Tan
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh PC
- International Application: PCT/US2014/036133 WO 20140430
- International Announcement: WO2015/167520 WO 20151105
- Main IPC: G06F17/50
- IPC: G06F17/50 ; B33Y50/02 ; B29C67/00 ; B33Y10/00 ; B29C64/165 ; B29C64/386 ; B29C64/40

Abstract:
In a computational modeling method for identifying how to apply a modifying agent during a three-dimensional (3D) printing method, a thermal diffusion model of a layer of a 3D object to be formed from a portion of a sinterable material using the 3D printing method is created. The thermal diffusion model is created by a computer running computer readable instructions stored on a non-transitory, tangible computer readable storage medium. A quantity of the modifying agent to be selectively applied is calculated, by the computer, based upon the thermal diffusion model.
Public/Granted literature
- US20170151722A1 COMPUTATIONAL MODEL AND THREE-DIMENSIONAL (3D) PRINTING METHODS Public/Granted day:2017-06-01
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