Invention Grant
- Patent Title: Method for forming an aligned mask
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Application No.: US15810551Application Date: 2017-11-13
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Publication No.: US10474027B2Publication Date: 2019-11-12
- Inventor: Chin-Cheng Yang
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfield LLP
- Main IPC: G03F1/42
- IPC: G03F1/42 ; H01L27/11521 ; H01L27/11556 ; H01L27/11526 ; H01L27/11568 ; H01L27/11582 ; G03F1/76 ; H01L21/768 ; H01L23/528 ; H01L23/522 ; G03F1/80 ; H01L27/11573 ; G03F9/00 ; H01L27/11548 ; H01L27/11575

Abstract:
A method for forming an aligned mask comprises etching a reference mark on a substrate to demarcate a boundary of an etch region; forming an etch mask on the substrate, using an exposure setting, the etch mask having a boundary; and measuring a distance between the reference mark and the boundary. When the measured distance is outside a margin of a target distance, then the etch mask is removed from the substrate, the exposure setting is changed, a next etch mask is formed using the changed exposure setting, and said measuring is repeated. A set of reference marks can be etched on a top level in a set of levels to demarcate boundaries of etch regions. An etch-trim process can be performed to form steps in the set of levels, wherein the etch-trim process includes at least first and second etch-trim cycles using first and second reference marks.
Public/Granted literature
- US20190146330A1 METHOD FOR FORMING AN ALIGNED MASK Public/Granted day:2019-05-16
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