Invention Grant
- Patent Title: Packaged semiconductor device with a particle roughened surface
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Application No.: US16252412Application Date: 2019-01-18
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Publication No.: US10475729B2Publication Date: 2019-11-12
- Inventor: Vikas Gupta , Daniel Yong Lin
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31
Abstract:
A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.
Public/Granted literature
- US20190157195A1 PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE Public/Granted day:2019-05-23
Information query
IPC分类:
