Invention Grant
- Patent Title: Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods
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Application No.: US15878725Application Date: 2018-01-24
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Publication No.: US10475771B2Publication Date: 2019-11-12
- Inventor: Wei Zhou , Bret K. Street
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01L25/065 ; H01L23/495 ; H01L23/552 ; H01L23/48 ; H01L25/00 ; H01L23/00
Abstract:
A semiconductor device includes a first die; a first metal enclosure directly contacting and vertically extending below the first die, wherein the first metal enclosure peripherally encircles a first enclosed space; a second die directly contacting the first metal enclosure opposite the first die; a second metal enclosure directly contacting and vertically extending below the second die, wherein the second metal enclosure peripherally encircles a second enclosed space; and an enclosure connection mechanism directly contacting the first metal enclosure and the second metal enclosure for electrically coupling the first metal enclosure and the second metal enclosure.
Public/Granted literature
Information query
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