利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

3142 条记录 (耗时 0.024 秒)

    POWER SEMICONDUCTOR MODULE
    2.
    发明公开
    POWER SEMICONDUCTOR MODULE 审中-公开

    公开(公告)号：US20240355704A1

    公开(公告)日：2024-10-24

    申请号：US18762854

    申请日：2024-07-03

    申请人： Hitachi Energy Ltd

    发明人： Milad Maleki ,  Harald Beyer ,  Dominik Truessel

    IPC分类号： H01L23/40 ,  H01L23/31

    CPC分类号： H01L23/4006 ,  H01L23/3171 ,  H01L2023/4081 ,  H01L2023/4087

    摘要： A power semiconductor module includes a baseplate that has a first region at a first side located adjacent to an edge of the baseplate and proceeding in a first plane. An encapsulation material covers portions of the baseplate so that the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material. The baseplate at its first side is configured for being provided with an electric circuit and the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region.

    ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
    5.
    发明公开
    ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20240312863A1

    公开(公告)日：2024-09-19

    申请号：US18576230

    申请日：2022-06-28

    申请人： Tesla, Inc.

    发明人： Yong guo Li ,  Rishabh Bhandari ,  Aydin Nabovati ,  Vijaykumar Krithivasan ,  William Chang

    IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/40

    CPC分类号： H01L23/3675 ,  H01L21/4882 ,  H01L23/40

    摘要： Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

    Electrical component module
    10.
    发明授权
    Electrical component module 有权

    公开(公告)号：US12013171B2

    公开(公告)日：2024-06-18

    申请号：US16963978

    申请日：2019-01-22

    申请人： FUJITSU GENERAL LIMITED

    发明人： Yasushi Hika ,  Yukine Hatakeyama ,  Yuri Sugawara ,  Hideki Masago

    IPC分类号： H01L23/40 ,  F25D23/00 ,  H01L23/473 ,  H05K7/14 ,  H05K7/20 ,  F28D21/00

    CPC分类号： F25D23/003 ,  H01L23/4006 ,  H01L23/473 ,  H05K7/14 ,  H05K7/20 ,  F28D2021/0029

    摘要： An electrical component module includes a main board having a front surface on which an electronic component forming a part of a control circuit is mounted, a power board having a front surface on which a plurality of power devices forming a remaining part of the control circuit is mounted, and a fixed plate on which the main board and the power board are mounted. The fixed plate is attached to a machine section. The plurality of power devices is vertically arranged on the front surface of the power board and face a cooler for thermal coupling. The power board has a size in an upward and downward direction set to correspond to a size of the plurality of power devices vertically arranged in the upward and downward direction, and the main board has a size in the upward and downward direction set to correspond to the size of the power board in the upward and downward direction.