Invention Grant
- Patent Title: Wireless power receive coil for metal backed device
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Application No.: US15148653Application Date: 2016-05-06
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Publication No.: US10476304B2Publication Date: 2019-11-12
- Inventor: Seong Heon Jeong
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Hunter Clark PLLC
- Main IPC: H02J50/12
- IPC: H02J50/12 ; H02J7/02 ; H01F38/14 ; H04B5/00

Abstract:
An apparatus for wirelessly coupling power via a first magnetic field may include an electrically conductive casing portion configured to generate a second magnetic field in response to eddy currents induced in the electrically conductive casing portion by the first magnetic field. The electrically conductive casing portion may include a non-conductive area and a first slot. A power receiving element wound around the non-conductive area and crossing over the first slots can couple to the second magnetic field to output electrical current to wirelessly power or charge a load.
Public/Granted literature
- US20160352149A1 WIRELESS POWER RECEIVE COIL FOR METAL BACKED DEVICE Public/Granted day:2016-12-01
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