Invention Grant
- Patent Title: Method and device for installing profile of eUICC
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Application No.: US15325649Application Date: 2015-07-10
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Publication No.: US10476671B2Publication Date: 2019-11-12
- Inventor: Jonghan Park , Duckey Lee , Sangsoo Lee , Songyean Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2014-0090591 20140717
- International Application: PCT/KR2015/007215 WO 20150710
- International Announcement: WO2016/010312 WO 20160121
- Main IPC: H04W12/04
- IPC: H04W12/04 ; H04L9/08 ; H04W8/18 ; H04W88/18 ; H04W12/00 ; H04B1/3816 ; H04L29/06

Abstract:
The present disclosure relates to a method and a device for installing a profile of an embedded universal integrated circuit boards (eUICC) and, more particularly, to a method and a device for remotely installing mobile communication subscriber information (profile) substituting for a universal integrated circuit boards (UICC), on a security module. In an aspect, a network device, acquires at least one of or more profiles encrypted with a first password key and one or more first password keys encrypted with a second password key; and when profile installation for the eUICC starts, transmits to, at least one eUICC, the one or more encrypted profiles and the one or more encrypted first password keys, wherein, prior to the transmission, each first password key is re-encrypted with a third password key for installation by the corresponding one or more eUICCs.
Public/Granted literature
- US20170155507A1 METHOD AND DEVICE FOR INSTALLING PROFILE OF EUICC Public/Granted day:2017-06-01
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