- 专利标题: Single ended vias with shared voids
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申请号: US15882649申请日: 2018-01-29
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公开(公告)号: US10477672B2公开(公告)日: 2019-11-12
- 发明人: Melvin K. Benedict , Karl J. Bois
- 申请人: Hewlett Packard Enterprise Development LP
- 申请人地址: US TX Houston
- 专利权人: Hewlett Packard Enterprise Development LP
- 当前专利权人: Hewlett Packard Enterprise Development LP
- 当前专利权人地址: US TX Houston
- 代理机构: Hewlett Packard Enterprise Patent Department
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/11 ; H05K1/18 ; H01R12/71
摘要:
An electronic device includes a printed circuit board. The printed circuit board includes a plurality of different signaling planes and a plurality of different reference planes. A single ended via interconnects the plurality of different signaling planes. A return via interconnects the plurality of different reference planes. The electronic device includes a shared void that includes the single ended via and the return via.
公开/授权文献
- US20190239338A1 SINGLE ENDED VIAS WITH SHARED VOIDS 公开/授权日:2019-08-01
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