METHODS AND SYSTEMS FOR TRANSPOSITION CHANNEL ROUTING

    公开(公告)号:US20220139791A1

    公开(公告)日:2022-05-05

    申请号:US17084375

    申请日:2020-10-29

    IPC分类号: H01L21/66 H01L21/768

    摘要: Systems and assemblies are provided for transposition channel routing where the characteristics of an escape route can be modified on a printed circuit board (PCB) in a manner that reduces crosstalk and realizes significant signal quality improvement. The techniques involve “transposition” of a signal line pair on the PCB, reduces effect coupling coefficients for individual aggressor signals, thereby reducing the crosstalk. Transposition channel routing techniques can also be applied to other areas on a PCB (e.g., other than escape routes) where space is constrained and other mitigation techniques are not possible. The PCB can include an array of contact pads, a plurality of signal line pairs that include an escape route. One or more transposition junctions disposed within the escape route can route a signal line pair from a first routing channel in the escape route into a second routing channel in the escape route.

    Methods and systems for exchange bus routing

    公开(公告)号:US11281833B1

    公开(公告)日:2022-03-22

    申请号:US17084343

    申请日:2020-10-29

    摘要: Systems and assemblies are provided for exchanged signal routing where the characteristics of an escape route can be modified on a printed circuit board (PCB) in a manner that reduces crosstalk and realizes significant signal quality improvement. Exchanged signal routing techniques involve “exchanging” the signal routing lanes on the PCB, which reduces coupled signal amplitude and phase relationship. Exchanged signal routing techniques can also be applied to other areas on a PCB (e.g., other than escape routes) where space is constrained and other mitigation techniques are not possible. A printed circuit board (PCB) can include an array of contact pads, a plurality of signal lines that include an escape route. One or more exchange junctions disposed within the escape route can route a first signal line of a first routing channel in the escape route into a second routing channel in the escape route.

    Defected ground structure to minimize EMI radiation

    公开(公告)号:US10178761B2

    公开(公告)日:2019-01-08

    申请号:US15141131

    申请日:2016-04-28

    摘要: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer, and as an antenna radiates the EMI propagated by the strip lines along the signaling layer outwards from the circuit board. A defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines to minimize the EMI that the element radiates outwards as the antenna.

    DEFECTED GROUND STRUCTURE TO MINIMIZE EMI RADIATION

    公开(公告)号:US20170318665A1

    公开(公告)日:2017-11-02

    申请号:US15141131

    申请日:2016-04-28

    摘要: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer, and as an antenna radiates the EMI propagated by the strip lines along the signaling layer outwards from the circuit board. A defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines to minimize the EMI that the element radiates outwards as the antenna.

    SINGLE ENDED VIAS WITH SHARED VOIDS
    6.
    发明申请

    公开(公告)号:US20190239338A1

    公开(公告)日:2019-08-01

    申请号:US15882649

    申请日:2018-01-29

    摘要: An electronic device includes a printed circuit board. The printed circuit board includes a plurality of different signaling planes and a plurality of different reference planes. A single ended via interconnects the plurality of different signaling planes. A return via interconnects the plurality of different reference planes. The electronic device includes a shared void that includes the single ended via and the return via.

    DEFECTED GROUND STRUCTURE WITH VOID HAVING RESISTIVE MATERIAL ALONG PERIMETER TO IMPROVE EMI SUPPRESSION

    公开(公告)号:US20190021164A1

    公开(公告)日:2019-01-17

    申请号:US15650223

    申请日:2017-07-14

    IPC分类号: H04B3/28 H05K1/02 H05K9/00

    摘要: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.

    Symmetry verifications for differential signal vias of an electronic circuit design

    公开(公告)号:US09971864B2

    公开(公告)日:2018-05-15

    申请号:US15217284

    申请日:2016-07-22

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5081

    摘要: A system may include an input engine and a symmetry verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a particular net in the electronic circuit design. The a symmetry verification engine may identify a pair of differential signal vias in the electronic circuit design corresponding to the particular net and determine a verification area surrounding the pair of differential signal vias. The symmetry verification engine may also verify that a particular ground via within the verification area satisfies symmetry criteria with respect to the pair of differential signal vias.

    POWER PROXIMITY VERIFICATIONS FOR ELECTRONIC CIRCUIT DESIGNS

    公开(公告)号:US20180089358A1

    公开(公告)日:2018-03-29

    申请号:US15280906

    申请日:2016-09-29

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5081 G06F2217/78

    摘要: Examples describe a system that may include an input engine and a proximity verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool, may identify a particular signal net and a particular power net the particular signal net is referenced to in the electronic circuit design. The input engine may further identify a particular signal via in the electronic circuit design corresponding to the particular signal net and power vias in the electronic circuit design corresponding to the particular power net. In such examples, the proximity verification engine may also verify that the particular signal via is within a threshold distance from at least one of the power vias and generate a proximity alert in response to a determination that none of the power vias are within the threshold distance from the particular signal via.

    SYMMETRY VERIFICATIONS FOR DIFFERENTIAL SIGNAL VIAS OF AN ELECTRONIC CIRCUIT DESIGN

    公开(公告)号:US20180025107A1

    公开(公告)日:2018-01-25

    申请号:US15217284

    申请日:2016-07-22

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5081

    摘要: A system may include an input engine and a symmetry verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a particular net in the electronic circuit design. The a symmetry verification engine may identify a pair of differential signal vias in the electronic circuit design corresponding to the particular net and determine a verification area surrounding the pair of differential signal vias. The symmetry verification engine may also verify that a particular ground via within the verification area satisfies symmetry criteria with respect to the pair of differential signal vias.