A method of manufacturing a printed board includes perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board. An insulating layer is provided. The metal foil having the through-hole is provided on the insulating layer in the thickness direction. An adhesive is provided between the insulating layer and the metal foil having the through-hole. The metal foil is pressed toward the insulating layer to bond the metal foil to the insulating layer via the adhesive. A mask is provided on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil. The exposed part of the metal foil is etched to provide a wiring pattern on the insulating layer.