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公开(公告)号：US11934003B2
公开(公告)日：2024-03-19
申请号：US17872598
申请日：2022-07-25
申请人： NICHIA CORPORATION
IPC分类号： F21V8/00
CPC分类号： G02B6/0088 , G02B6/0016 , G02B6/0043 , G02B6/0085
摘要： A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.
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公开(公告)号：US11616180B2
公开(公告)日：2023-03-28
申请号：US16854656
申请日：2020-04-21
申请人： NICHIA CORPORATION
摘要： A light emitting device includes a base, a first external terminal, a second external terminal, a plurality of wirings respectively electrically connecting the first external terminal and the second external terminal, and a plurality of light emitting elements each electrically connected to a corresponding one of the wirings. The wirings include a first wiring connecting the first external terminal and the second external terminal at a smallest distance, a second wiring longer than the first wiring, and a third wiring longer than the second wiring. The first, second, and third wirings have a substantially equal electric resistance. At least two of the first, second and third wirings are each provided with at least two of the light emitting elements with an average width in an intermediate region between adjacent ones of the light emitting elements being smaller than an average width in a region other than the intermediate region.
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公开(公告)号：US11611014B2
公开(公告)日：2023-03-21
申请号：US17580193
申请日：2022-01-20
申请人： NICHIA CORPORATION
发明人： Eiko Minato , Koji Taguchi , Yumiko Kameshima , Masaaki Katsumata
IPC分类号： H01L33/00 , H01L25/075 , H01L33/24 , H01L33/62
摘要： A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.
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公开(公告)号：US11026335B2
公开(公告)日：2021-06-01
申请号：US16553086
申请日：2019-08-27
申请人： NICHIA CORPORATION
发明人： Rie Maeda , Masaaki Katsumata
摘要： A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.
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公开(公告)号：US10851973B2
公开(公告)日：2020-12-01
申请号：US16145689
申请日：2018-09-28
申请人： NICHIA CORPORATION
IPC分类号： F21V19/00 , G02F1/13357 , H05K1/00 , H01L33/62 , F21Y105/16 , F21Y115/10 , H01L25/075
摘要： A light-emitting device includes a support board including a first base with flexibility and having a region where a first metal film is formed, a connection board disposed on an upper surface of the support board and including a second base on which a second metal film is formed, a light-emitting element mounted on the connection board, and a conductive member in contact with the first metal film and with the second metal film.
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6.发明授权公开(公告)号：US10477692B2
公开(公告)日：2019-11-12
申请号：US16145186
申请日：2018-09-28
申请人： NICHIA CORPORATION
IPC分类号： H05K1/18 , H05K1/02 , H05K3/32 , H05K3/38 , H05K3/06 , H05K3/00 , H05K3/30 , H05K1/11 , H01L33/62
摘要： A method of manufacturing a printed board includes perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board. An insulating layer is provided. The metal foil having the through-hole is provided on the insulating layer in the thickness direction. An adhesive is provided between the insulating layer and the metal foil having the through-hole. The metal foil is pressed toward the insulating layer to bond the metal foil to the insulating layer via the adhesive. A mask is provided on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil. The exposed part of the metal foil is etched to provide a wiring pattern on the insulating layer.
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公开(公告)号：US11894498B2
公开(公告)日：2024-02-06
申请号：US17863393
申请日：2022-07-13
申请人： NICHIA CORPORATION
发明人： Rie Maeda , Masaaki Katsumata
CPC分类号： H01L33/56 , H01L33/0095 , H01L33/62
摘要： A light emitting device including a first light emitting element that includes a first electrode having a first polarity and a second electrode having a second polarity that is different from the first polarity. The device has a circuit element that includes a main body, and first and second terminals electrically connected with one another via the main body. The device includes a first wiring having the first polarity connecting the first electrode of the first light emitting element and the first terminal, and a second wiring having the second polarity located in a layer common with a layer of the first wiring and including a portion elongated between the first terminal and the second terminal in a bottom view. An upper surface of the main body is positioned at a distance below an interface between a lower surface of the first wiring and the first electrode.
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公开(公告)号：US11888088B2
公开(公告)日：2024-01-30
申请号：US17830148
申请日：2022-06-01
申请人： NICHIA CORPORATION
发明人： Yoshiki Sato , Masaaki Katsumata , Shinichi Daikoku , Yoshikazu Matsuda , Ryuma Marume , Eiko Minato
IPC分类号： H01L23/00 , H01L33/48 , H01L33/58 , H01L33/62 , H01L33/10 , H01L33/36 , H01L33/60 , H01L33/44 , H01L33/00 , H01L25/075
CPC分类号： H01L33/0095 , H01L25/0753 , H01L2933/0016 , H01L2933/0058 , H01L2933/0066
摘要： A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.
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公开(公告)号：US11864317B2
公开(公告)日：2024-01-02
申请号：US17107953
申请日：2020-12-01
申请人： NICHIA CORPORATION
发明人： Masaaki Katsumata , Koji Taguchi , Norifumi Sasaoka , Yosuke Noda
CPC分类号： H05K1/115 , H01L21/486 , H01L21/4846 , H01L23/481 , H01L23/49822 , H01L33/62 , H05K1/095 , H05K3/0094 , H05K3/4038 , H05K3/4069 , H01L2933/0066 , H05K1/112 , H05K2201/09454 , H05K2201/09572 , H05K2201/09854 , H05K2201/10106 , H05K2203/0126 , H05K2203/0139 , H05K2203/0278 , H05K2203/1105
摘要： A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.
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公开(公告)号：US11276807B2
公开(公告)日：2022-03-15
申请号：US16581627
申请日：2019-09-24
申请人： NICHIA CORPORATION
发明人： Rie Maeda , Masaaki Katsumata
IPC分类号： H01L33/62 , H01L25/075 , H01L33/56 , H01L33/36 , G02F1/13357
摘要： A light-emitting device manufacturing method including providing a light-emitting structure including one or more light-emitting elements and a covering member covering the light-emitting elements. Each of the light-emitting elements have first and second electrodes. The light-emitting structure has a first surface and a second surface opposite to the first surface, and lower surfaces of the first and second electrodes of each light-emitting element are closer to the first surface than the second surface. The method further includes forming a groove structure on the first surface side by irradiation with laser light such that at least part of the first and second electrodes are exposed to an inside of the groove structure, and forming a plurality of wirings inside of the groove structure.
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