Invention Grant
- Patent Title: Acoustic emission monitoring and endpoint for chemical mechanical polishing
-
Application No.: US14639859Application Date: 2015-03-05
-
Publication No.: US10478937B2Publication Date: 2019-11-19
- Inventor: Jianshe Tang , David Masayuki Ishikawa , Benjamin Cherian , Jeonghoon Oh , Thomas H. Osterheld
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/013
- IPC: B24B37/013 ; B24B49/00
Abstract:
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and an in-situ acoustic emission monitoring system including an acoustic emission sensor supported by the platen, a waveguide configured to extending through at least a portion of the polishing pad, and a processor to receive a signal from the acoustic emission sensor. The in-situ acoustic emission monitoring system is configured to detect acoustic events caused by deformation of the substrate and transmitted through the waveguide, and the processor is configured to determine a polishing endpoint based on the signal.
Public/Granted literature
- US20160256978A1 Acoustic Emission Monitoring and Endpoint for Chemical Mechanical Polishing Public/Granted day:2016-09-08
Information query
