公开(公告)号：US12020159B2

公开(公告)日：2024-06-25

申请号：US18310520

申请日：2023-05-01

申请人： Applied Materials, Inc.

发明人： Benjamin Cherian ,  Nicholas A. Wiswell ,  Jun Qian ,  Thomas H. Osterheld

IPC分类号： G06N3/08 ,  G05B13/02 ,  G05B19/4063 ,  G05B19/4155 ,  G06N3/045 ,  H01L21/66

CPC分类号： G06N3/08 ,  G05B13/027 ,  G05B19/4063 ,  G05B19/4155 ,  G06N3/045 ,  H01L22/12 ,  G05B2219/32335 ,  G05B2219/40066 ,  G05B2219/41054 ,  G05B2219/45031 ,  G05B2219/45199

摘要： A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.

公开(公告)号：US20230390891A1

公开(公告)日：2023-12-07

申请号：US17952059

申请日：2022-09-23

申请人： Applied Materials, Inc.

发明人： Thomas H. Osterheld ,  Benjamin Cherian ,  Jun Qian ,  Haoquan Fang ,  Nicholas A. Wiswell ,  Sohrab Pourmand ,  Jeonghoon Oh ,  Brian J. Brown

IPC分类号： B24B49/00 ,  B24B49/18

CPC分类号： B24B49/003 ,  B24B49/186

摘要： A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and the conditioner disk so as to condition the polishing pad, an in-situ acoustic monitoring system having an acoustic sensor to receive acoustic signals from the conditioner disk, and a controller configured to analyze a signal from the acoustic sensor and determine a characteristic of the conditioner disk or conditioner head based on the signal.

公开(公告)号：US20230390885A1

公开(公告)日：2023-12-07

申请号：US17963143

申请日：2022-10-10

申请人： Applied Materials, Inc.

发明人： Nicholas A. Wiswell ,  Benjamin Cherian ,  Jun Qian ,  Thomas H. Osterheld

IPC分类号： B24B37/005 ,  G01H11/08

CPC分类号： B24B37/005 ,  G01H11/08

摘要： A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to determine an angular orientation of the substrate based on received acoustic signals from the in-situ acoustic monitoring system.

公开(公告)号：US11780046B2

公开(公告)日：2023-10-10

申请号：US17896008

申请日：2022-08-25

申请人： Applied Materials, Inc.

发明人： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B41/02 ,  B24B53/02

CPC分类号： B24B37/005 ,  B24B37/013 ,  B24B37/20 ,  B24B37/205 ,  B24B41/02 ,  B24B49/12 ,  B24B53/02

摘要： A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

公开(公告)号：US20230267329A1

公开(公告)日：2023-08-24

申请号：US18310520

申请日：2023-05-01

申请人： Applied Materials, Inc.

发明人： Benjamin Cherian ,  Nicholas A. Wiswell ,  Jun Qian ,  Thomas H. Osterheld

IPC分类号： G06N3/08 ,  G05B19/4063 ,  G05B19/4155 ,  H01L21/66 ,  G05B13/02 ,  G06N3/045

CPC分类号： G06N3/08 ,  G05B19/4063 ,  G05B19/4155 ,  H01L22/12 ,  G05B13/027 ,  G06N3/045 ,  G05B2219/45199 ,  G05B2219/32335 ,  G05B2219/45031 ,  G05B2219/40066 ,  G05B2219/41054

摘要： A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.

公开(公告)号：US11731238B2

公开(公告)日：2023-08-22

申请号：US16820299

申请日：2020-03-16

申请人： Applied Materials, Inc

发明人： Thomas H. Osterheld ,  Benjamin Cherian

IPC分类号： G06T7/529 ,  G06T7/40 ,  G06T17/30 ,  G06V10/10 ,  G06V10/82 ,  B24B49/12 ,  B24B37/005

CPC分类号： B24B49/12 ,  B24B37/005 ,  G06T7/40 ,  G06T7/529 ,  G06T17/30 ,  G06V10/10 ,  G06V10/82 ,  G06T2207/20081

摘要： An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to press an abrasive body against the polishing surface, an in-situ polishing pad monitoring system including an imager disposed above the platen to capture an image of the polishing pad, and a controller configured to receive the image from the monitoring system and generate a measure of polishing pad surface roughness based on the image. The controller can use machine-learning based image processing to generate the measure of surface roughness.

公开(公告)号：US11701749B2

公开(公告)日：2023-07-18

申请号：US16351954

申请日：2019-03-13

申请人： Applied Materials, Inc.

发明人： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Chih Chung Chou ,  Nicholas Wiswell ,  Thomas H. Osterheld ,  Jeonghoon Oh

IPC分类号： B24B37/04 ,  B24B49/12 ,  H01L21/66 ,  B24B37/013

CPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/12 ,  H01L22/12 ,  H01L22/26

摘要： A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.

公开(公告)号：US11651207B2

公开(公告)日：2023-05-16

申请号：US16449104

申请日：2019-06-21

申请人： Applied Materials, Inc.

发明人： Benjamin Cherian ,  Nicholas Wiswell ,  Jun Qian ,  Thomas H. Osterheld

IPC分类号： G06N3/08 ,  G06N3/04 ,  G05B19/4063 ,  G05B19/4155 ,  H01L21/66 ,  G05B13/02

CPC分类号： G06N3/08 ,  G05B13/027 ,  G05B19/4063 ,  G05B19/4155 ,  G06N3/0454 ,  H01L22/12 ,  G05B2219/32335 ,  G05B2219/40066 ,  G05B2219/41054 ,  G05B2219/45031 ,  G05B2219/45199

摘要： A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.

公开(公告)号：US20220347813A1

公开(公告)日：2022-11-03

申请号：US17730811

申请日：2022-04-27

申请人： Applied Materials, Inc.

发明人： Thomas H. Osterheld ,  Benjamin Cherian

IPC分类号： B24B37/005

摘要： A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, a temperature monitoring system including a non-contact thermal imaging camera positioned above the platen to have a field of view of a portion of the polishing pad on the platen, and a controller. The controller is configured to receive the thermal image from the temperature monitoring system, input the thermal image into a machine learning model trained by training examples to determine an indication for one or more of 1) a presence of a process excursion, 2) a substrate state, or 3) a diagnosis for the process excursion, and receive from the machine learning model the indication.

公开(公告)号：US20220283554A1

公开(公告)日：2022-09-08

申请号：US17681673

申请日：2022-02-25

申请人： Applied Materials, Inc.

发明人： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu ,  Benjamin Cherian ,  Brian J. Brown ,  Thomas H. Osterheld

IPC分类号： G05B13/04 ,  B24B49/00 ,  B24B49/12 ,  B24B49/16 ,  B24B37/005

摘要： Generating a recipe for a polishing process includes receiving a target removal profile that includes a target thickness to remove for locations spaced angularly around a center of a substrate, storing a first function providing substrate orientation relative to a carrier head over time, storing a second function defining a polishing rate below a zone of the zone as a function of one or more pressures of one or more zones of the carrier head, and for each particular zone of the plurality of zones, calculate a recipe defining a pressure for the particular zone over time. Calculating the recipe includes calculating an expected thickness profile after polishing from the second function defining the polishing rate and the first function providing substrate orientation relative to the zone over time, and applying a minimizing algorithm to reduce a difference between the expected thickness profile and the target thickness profile.