Invention Grant
- Patent Title: Multilayer structure, packaging material and product including same, and protective sheet for electronic device
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Application No.: US15538985Application Date: 2015-12-24
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Publication No.: US10479055B2Publication Date: 2019-11-19
- Inventor: Ryoichi Sasaki , Yasutaka Inubushi
- Applicant: KURARAY CO., LTD.
- Applicant Address: JP Kurashiki-shi
- Assignee: KURARAY CO., LTD.
- Current Assignee: KURARAY CO., LTD.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-261115 20141224; JP2015-024780 20150210; JP2015-024781 20150210
- International Application: PCT/JP2015/006455 WO 20151224
- International Announcement: WO2016/103716 WO 20160630
- Main IPC: B65D65/40
- IPC: B65D65/40 ; B32B27/08 ; B32B27/36 ; B32B27/34 ; B32B27/32 ; B32B7/12 ; B32B27/26 ; B32B27/10 ; B32B27/00
Abstract:
The present invention relates to a multilayer structure including a base (X) and a layer (Y) stacked on the base (X). The layer (Y) contains an aluminum-containing compound (A), an organic phosphorus compound (BO), and a polymer (F) having an ether bond and having no glycosidic bond.
Public/Granted literature
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