Invention Grant
- Patent Title: Inspection method, inspection system, and method of manufacturing semiconductor package using the same
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Application No.: US15626675Application Date: 2017-06-19
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Publication No.: US10482593B2Publication Date: 2019-11-19
- Inventor: Younghoon Sohn , Yusin Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0084327 20160704
- Main IPC: G06T7/00
- IPC: G06T7/00 ; H01L21/66 ; H01L23/00

Abstract:
An inspection method includes generating first layout data including information on a shape of a first pattern group, generating second layout data including information on a shape of a second pattern group, obtaining a target image including images of the first and second pattern groups, and detecting a defect pattern from the target image by comparing the first and second layout data with the target image. The first pattern group, the second pattern group, and the defect pattern are provided at different heights from each other, from a top surface of a substrate.
Public/Granted literature
- US20180005369A1 INSPECTION METHOD, INSPECTION SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2018-01-04
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