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公开(公告)号：US12110938B2
公开(公告)日：2024-10-08
申请号：US17718423
申请日：2022-04-12
发明人： Hyunchul Kim , Souk Kim , Younghoon Sohn
IPC分类号： F16F15/02
CPC分类号： F16F15/02
摘要： A vibration isolation table of the disclosure may include a lower structure including a plurality of block structures, a middle structure on the lower structure, and an upper structure on the middle structure. The plurality of block structures may be spaced apart from one another such that a space is formed between adjacent ones of the plurality of block structures. At least one of the lower structure and the upper structure may include high attenuation concrete.
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2.发明公开公开(公告)号：US20240241067A1
公开(公告)日：2024-07-18
申请号：US18460675
申请日：2023-09-04
发明人： Seungchul Lee , Younghoon Sohn
IPC分类号： G01N23/223 , G01N23/207 , H01L21/66
CPC分类号： G01N23/223 , G01N23/207 , H01L22/12 , G01N2223/6116
摘要： An apparatus for measuring a thickness of a metal layer includes a light source unit configured to generate X-rays, a detection unit configured to detect the X-rays diffracted from a specimen, and a processor configured to measure the thickness of the metal layer of the specimen using an intensity of the X-rays diffracted from the specimen.
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3.发明公开公开(公告)号：US20230194567A1
公开(公告)日：2023-06-22
申请号：US17878414
申请日：2022-08-01
发明人： Kwangeun Kim , Seungbum Hong , Sungyoon Ryu , Hoon Kim , Jiwon Yeom , Seokjung Yun , Souk Kim , Younghoon Sohn , Yusin Yang
CPC分类号： G01Q40/00 , H01L22/12 , G01Q70/10 , H01L27/10876
摘要： A method of operating an atomic force microscope (AFM) is provided. The method includes inspecting a sample by using the AFM and inspecting a tip of a probe of the AFM by using a characterization sample. The characterization sample includes a first characterization pattern that includes a line and space pattern of a first height, a second characterization pattern that includes a line and space pattern of a second height that is lower than the first height, and a third characterization pattern that includes a line and space pattern of a third height that is lower than the second height, and includes a rough surface.
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公开(公告)号：US20240255439A1
公开(公告)日：2024-08-01
申请号：US18367784
申请日：2023-09-13
发明人： Heeyoon Han , Donghoon Kim , Sungyoon Ryu , Younghoon Sohn , Sunhong Jun
CPC分类号： G01N21/9501 , G01N21/31 , G06N20/00
摘要： A defect detection method includes radiating light onto a substrate, obtaining a spectrum image, performing an electrical die sorting (EDS) test on the substrate, inspecting defects of each of a plurality of blocks of the substrate based on a result of the EDS test, generating a defect map, generating spectrum image information by matching the spectrum image with the defect map, training a defect detection model by using the defect grade as an output value and the spectrum image information as an input value, obtaining a target spectrum image with respect to a target substrate, extracting a feature vector from the target spectrum image by using the defect detection model, and detecting a target defect grade of the target spectrum image based on the feature vector, and generating a target defect map based on the target defect grade.
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5.发明公开公开(公告)号：US20230384212A1
公开(公告)日：2023-11-30
申请号：US18097924
申请日：2023-01-17
发明人： Donghyun LEE , Sungyoon Ryu , Sooseok Lee , Younghoon Sohn
CPC分类号： G01N21/1702 , G01N21/9501 , H01L22/30 , H01L22/12 , H10B43/27 , G01N2021/1706
摘要： An inspection method is provided. The inspection method includes inspecting a plurality of first observation sites by detecting ultrasonic signals emitted from the plurality of first observation sites, inspecting a plurality of second observation sites by detecting ultrasonic signals emitted from the plurality of second observation sites; and inspecting a target structure by detecting an ultrasonic signal emitted from the target structure, where the target structure includes a structure of interest, and wherein the plurality of first observation sites are intermediate results of forming the target structure, respectively, and the plurality of second observation sites are structures modified from the target structure.
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6.发明公开公开(公告)号：US20230184691A1
公开(公告)日：2023-06-15
申请号：US17881367
申请日：2022-08-04
发明人： Yusin Yang , Sungyoon Ryu , Younghoon Sohn
IPC分类号： G01N21/88 , G01N21/956 , G01N21/95 , G06T7/00
CPC分类号： G01N21/8806 , G01N21/956 , G01N21/9501 , G06T7/0004 , G01N2021/8887 , G01N2021/8835 , G01N2021/8848 , G06T2200/04 , G06T2207/30148 , G06T2207/10152 , G06T2207/10012 , G06T2207/10148
摘要： A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incident onto the wafer to be in-focus; and an image processor configured to integrate the optical intensity image with vertical level data of the in-focus to generate and analyze a three-dimensional (3D) image.
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公开(公告)号：US20180096903A1
公开(公告)日：2018-04-05
申请号：US15832938
申请日：2017-12-06
发明人： Younghoon Sohn , Jinsung Kim , Yusin Yang , Chungsam Jun
IPC分类号： H01L21/66 , H01L23/00 , H01L21/027 , H01L21/311 , H01L21/768 , H01L21/56 , H01L21/67 , H01L21/683 , H01L21/48 , H01L21/02
CPC分类号： H01L22/12 , H01L21/02164 , H01L21/0217 , H01L21/02271 , H01L21/0274 , H01L21/31144 , H01L21/4846 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67259 , H01L21/6835 , H01L21/76802 , H01L21/76895 , H01L22/20 , H01L23/3128 , H01L24/06 , H01L24/11 , H01L2221/68345 , H01L2224/02311 , H01L2224/04105 , H01L2224/12105 , H01L2224/13024 , H01L2224/14131 , H01L2224/96 , H01L2924/1433 , H01L2924/1434 , H01L2924/15153 , H01L2924/152 , H01L2924/15747
摘要： A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.
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公开(公告)号：US20240295490A1
公开(公告)日：2024-09-05
申请号：US18237589
申请日：2023-08-24
发明人： Jaeho Kim , Younghoon Sohn , Sunhong Jun
IPC分类号： G01N21/25 , G01N21/956
CPC分类号： G01N21/255 , G01N21/956 , G01N2201/06113 , G01N2201/0683
摘要： A measurement apparatus includes a light source assembly configured to emit light to a sample, a measuring device configured to measure reflected light, and a stage on which the sample is provided, where the light source assembly includes a first plate, a plurality of light sources connected to the first plate and a blocking panel comprising a hole, and one of the plurality of light sources is aligned with the hole in a first direction.
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公开(公告)号：US20240255274A1
公开(公告)日：2024-08-01
申请号：US18425830
申请日：2024-01-29
发明人： Changi Jeon , Younghoon Sohn
摘要： Provided is a complex sensing device including a thickness sensing device including pulse generating device configured to generate a probe pulse and a pump pulse, a first optical splitter configured to split the probe pulse and direct the pump pulse to a surface of a sample and generate an acoustic signal in the sample, a detector configured to receive a reflection probe pulse generated by the probe pulse being reflected from the sample, a first processor configured to receive and process a first signal from the detector, and a second optical splitter on a path of the reflection probe pulse from the sample to the detector, the second optical splitter being configured to split the reflection probe pulse, and a surface shape sensing device configured to receive a split probe pulse split from the first optical splitter and a split reflection probe pulse split from the second optical splitter, and measure a surface shape of the sample based on a phase difference between the split probe pulse and the split reflection probe pulse.
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公开(公告)号：US20240230528A1
公开(公告)日：2024-07-11
申请号：US18389028
申请日：2023-11-13
发明人： Sunhong Jun , Inkeun Baek , Wontae Kim , Namil Koo , Ingi Kim , Sungyoon Ryu , Younghoon Sohn , Yusin Yang , Ikseon Jeon , Eunhyuk Choi
IPC分类号： G01N21/3581 , G01N21/95 , H01L21/66
CPC分类号： G01N21/3581 , G01N21/9501 , H01L22/12
摘要： A measuring apparatus includes a stage including a transmissive wafer chuck on which a sample wafer is provided, where the sample wafer includes a silicon substrate and at least one material layer on the silicon substrate, a light source unit including a light source configured to generate and output a femtosecond laser beam, and a confocal laser-induced terahertz (THz) emission microscopy (LTEM) unit configured to generate multi-photon excitation by splitting the femtosecond laser beam into four sub-laser beams and causing three sub-laser beams among the four sub-laser beams to be incident in an overlapping manner on a measurement position of the sample wafer, where the confocal LTEM unit is configured to generate the multi-photon excitation based on the three sub-laser beams being incident on a lower surface of the silicon substrate.
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