- 专利标题: Warpage balancing in thin packages
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申请号: US15977905申请日: 2018-05-11
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公开(公告)号: US10483217B2公开(公告)日: 2019-11-19
- 发明人: Belgacem Haba , Sangil Lee , Craig Mitchell , Gabriel Z. Guevara , Javier A. Delacruz
- 申请人: Invensas Corporation
- 申请人地址: US CA San Jose
- 专利权人: Invensas Corporation
- 当前专利权人: Invensas Corporation
- 当前专利权人地址: US CA San Jose
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; H01L23/498 ; H01L23/00 ; B23K1/00 ; H01L23/538 ; H01L23/31
摘要:
Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.
公开/授权文献
- US20180261556A1 Warpage Balancing In Thin Packages 公开/授权日:2018-09-13
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