Invention Grant
- Patent Title: Semiconductor device with support pattern
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Application No.: US16115690Application Date: 2018-08-29
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Publication No.: US10483346B2Publication Date: 2019-11-19
- Inventor: Ki-hyung Nam , Bong-Soo Kim , Yoosang Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2018-0000772 20180103
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L49/02 ; H01L27/108 ; H01L21/311 ; H01L21/285 ; H01L21/02 ; H01L21/3213 ; H01L27/112
Abstract:
A semiconductor device including a plurality of pillars on a semiconductor substrate; and a support pattern in contact with some lateral surfaces of the pillars and connecting the pillars with one another, wherein the support pattern includes openings that expose other lateral surfaces of the pillars, each of the pillars includes a first pillar upper portion in contact with the support pattern and a second pillar upper portion spaced apart from the support pattern, and the second pillar upper portion has a concave slope.
Public/Granted literature
- US20190206983A1 SEMICONDUCTOR DEVICE WITH SUPPORT PATTERN Public/Granted day:2019-07-04
Information query
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