Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15982775Application Date: 2018-05-17
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Publication No.: US10483348B2Publication Date: 2019-11-19
- Inventor: Hidetoshi Tanaka
- Applicant: SOCIONEXT, INC.
- Applicant Address: JP Kanagawa
- Assignee: SOCIONEXT, INC.
- Current Assignee: SOCIONEXT, INC.
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2017-103566 20170525
- Main IPC: H01L31/113
- IPC: H01L31/113 ; H01L31/119 ; H01L29/06 ; H01L27/02 ; H01L29/786 ; H01L29/78

Abstract:
A semiconductor device has transistors formed on a substrate and including first and second impurity regions of a first conductivity type, a guard ring of a second conductivity type formed on the substrate and surrounding the transistors in a plan view, a wiring formed on and electrically connected to the guard ring, and a ground wiring faulted on the wiring and electrically connected to the wiring and the second impurity region. In a plan view, the transistor includes a first part having a distance that is a first distance from the guard ring, and a second part having a distance that is a second distance shorter than the first distance from the guard ring. In a plan view, the first part is located at a position separated from the ground wiring, and the second part is located at a position overlapping the ground wiring.
Public/Granted literature
- US20180342575A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-11-29
Information query
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