Invention Grant
- Patent Title: Fin field effect transistor and method of forming the same
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Application No.: US14582576Application Date: 2014-12-24
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Publication No.: US10483397B2Publication Date: 2019-11-19
- Inventor: Ju-Wang Hsu , Chih-Yuan Ting , Tang-Xuan Zhong , Yi-Nien Su , Jang-Shiang Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L29/66 ; H01L29/06

Abstract:
A fin field effect transistor and method of forming the same. The fin field effect transistor includes a semiconductor substrate having a fin structure and between two trenches with top portions and bottom portions. The fin field effect transistor further includes shallow trench isolations formed in the bottom portions of the trenches and a gate electrode over the fin structure and the shallow trench isolation, wherein the gate electrode is substantially perpendicular to the fin structure. The fin field effect transistor further includes a gate dielectric layer along sidewalls of the fin structure and source/drain electrode formed in the fin structure.
Public/Granted literature
- US20150137265A1 FIN FIELD EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME Public/Granted day:2015-05-21
Information query
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