Invention Grant
- Patent Title: Power amplification module
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Application No.: US15926165Application Date: 2018-03-20
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Publication No.: US10483928B2Publication Date: 2019-11-19
- Inventor: Yasushi Oyama , Takayuki Tsutsui , Kazuhito Nakai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2015-236095 20151202
- Main IPC: H03G1/00
- IPC: H03G1/00 ; H03F3/72 ; H03F3/24 ; H03F3/19 ; H03F3/213 ; H03F1/56

Abstract:
A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.
Public/Granted literature
- US20180212578A1 POWER AMPLIFICATION MODULE Public/Granted day:2018-07-26
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