Invention Grant
- Patent Title: Mold and process for producing porous devices
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Application No.: US16271516Application Date: 2019-02-08
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Publication No.: US10507606B2Publication Date: 2019-12-17
- Inventor: Wei-Hsiang Chang , Stephen Lee Laffoon , Christopher S. D. Lee
- Applicant: Vertera, Inc.
- Applicant Address: US GA Atlanta
- Assignee: Vertera, Inc.
- Current Assignee: Vertera, Inc.
- Current Assignee Address: US GA Atlanta
- Main IPC: B29C43/04
- IPC: B29C43/04 ; B29C33/00 ; B29C67/20 ; B29C44/58 ; C08J9/26 ; B29K71/00 ; B29L31/00

Abstract:
In general, in various embodiments, the present disclosure is directed systems and methods for producing a porous surface from a solid piece of polymer. In particular, the present disclosure is directed to systems that include a track assembly, mold assembly, press assembly, and methods for using the same for producing a porous surface from a solid piece of polymer. In some embodiments, the present systems and methods are directed to processing a polymer at a temperature below a melting point of the polymer to produce a solid piece of polymer with an integrated a porous surface.
Public/Granted literature
- US20190168424A1 MOLD AND PROCESS FOR PRODUCING POROUS DEVICES Public/Granted day:2019-06-06
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