Invention Grant
- Patent Title: Polycrystalline diamond compact
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Application No.: US16358281Application Date: 2019-03-19
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Publication No.: US10508502B2Publication Date: 2019-12-17
- Inventor: Kenneth E. Bertagnolli , David P. Miess , Jiang Qian , Jason K. Wiggins , Michael A. Vail , Debkumar Mukhopadhyay
- Applicant: US SYNTHETIC CORPORATION
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: E21B10/55
- IPC: E21B10/55 ; E21B10/573 ; E21B10/46 ; E21B10/567 ; E21B10/36 ; E21B10/56 ; F16C33/26 ; B22F7/08 ; C22C26/00 ; F16C33/04 ; B24D18/00 ; F16C17/02 ; F16C17/04

Abstract:
In an embodiment, a method of fabricating a polycrystalline diamond compact is disclosed. The method includes sintering a plurality of diamond particles in the presence of a metal-solvent catalyst to form a polycrystalline diamond body; leaching the polycrystalline diamond body to at least partially remove the metal-solvent catalyst therefrom, thereby forming an at least partially leached polycrystalline diamond body; and subjecting an assembly of the at least partially leached polycrystalline diamond body and a cemented carbide substrate to a high-pressure/high-temperature process at a pressure to infiltrate the at least partially leached polycrystalline diamond body with an infiltrant. The pressure of the high-pressure/high-temperature process is less than that employed in the act of sintering of the plurality of diamond particles.
Public/Granted literature
- US20190211629A1 POLYCRYSTALLINE DIAMOND COMPACT Public/Granted day:2019-07-11
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