- 专利标题： Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
-
申请号： US16110055申请日： 2018-08-23
-
公开(公告)号： US10510653B2公开(公告)日： 2019-12-17
- 发明人: Kelvin Po Leung Pun , Chee Wah Cheung
- 申请人： Compass Technology Company Limited
- 申请人地址： HK Hong Kong
- 专利权人： Compass Technology Company Limited
- 当前专利权人： Compass Technology Company Limited
- 当前专利权人地址： HK Hong Kong
- 代理机构： Saile Ackerman LLC
- 代理商 Stephen B. Ackerman; Rosemary L. S. Pike
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/56 ; H01L21/48 ; H01L23/31 ; H01L23/00
摘要：
A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising five different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.
公开/授权文献
信息查询
IPC分类:
