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公开(公告)号：US20240178124A1
公开(公告)日：2024-05-30
申请号：US18071819
申请日：2022-11-30
IPC分类号： H01L23/498 , H01L21/56 , H01L23/00 , H01L23/31
CPC分类号： H01L23/4985 , H01L21/56 , H01L23/3121 , H01L24/32 , H01L24/83 , H01L24/08 , H01L2224/08225 , H01L2224/32225 , H01L2224/838
摘要： A flexible substrate embedded die package is described comprising a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate, a semiconductor die attached by an adhesive to the flexible substrate and a dielectric bonding film surrounding the semiconductor die and sealing the semiconductor die to the flexible substrate.
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公开(公告)号：US11553598B2
公开(公告)日：2023-01-10
申请号：US17352562
申请日：2021-06-21
摘要： An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.
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公开(公告)号：US10917973B1
公开(公告)日：2021-02-09
申请号：US16801779
申请日：2020-02-26
发明人： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson , Wing Lung Hon , Yam Chong , Wai Yin Wong , Shengbo Lu , Chenmin Liu
IPC分类号： H05K1/18 , H05K1/09 , H05K3/28 , H01M10/0525 , H01M4/139
摘要： A flexible printed circuit board with a lithium ion battery printed thereon is achieved. The flexible printed circuit board comprises a top and a bottom electrically insulating base film, a top electrically conductive metal layer over the top electrically insulating base film, and a bottom electrically conductive metal layer under the bottom electrically insulating base film. A printable lithium ion battery sits in a cavity completely through the top and bottom base films wherein a top of the battery contacts the top electrically conductive metal layer and wherein a bottom of the battery contacts the bottom electrically conductive metal layer. An adhesive film around the battery seals it to the top and bottom electrically insulating base film and seals the top electrically conductive metal layer to the bottom electrically conductive metal layer.
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4.发明申请公开(公告)号：US20200035594A1
公开(公告)日：2020-01-30
申请号：US16591378
申请日：2019-10-02
摘要： A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising at least four different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.
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公开(公告)号：US20200013700A1
公开(公告)日：2020-01-09
申请号：US16575554
申请日：2019-09-19
IPC分类号： H01L23/498 , C23C18/16 , C25D3/38 , C25D5/02 , H01L21/48 , H01L23/538
摘要： A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni—P seed layer is electrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni—P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni—P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.
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公开(公告)号：US20190385936A1
公开(公告)日：2019-12-19
申请号：US16548373
申请日：2019-08-22
IPC分类号： H01L23/498 , H01L23/14 , H01L21/48 , C23C18/50 , C25D3/38 , C25D5/02 , B23K26/382
摘要： A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni—P seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni—P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni—P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.
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7.发明申请公开(公告)号：US20180366404A1
公开(公告)日：2018-12-20
申请号：US16110055
申请日：2018-08-23
IPC分类号： H01L23/498 , H01L21/56 , H01L21/48 , H01L23/31 , H01L23/00
摘要： A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising five different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.
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公开(公告)号：US10510653B2
公开(公告)日：2019-12-17
申请号：US16110055
申请日：2018-08-23
IPC分类号： H01L23/498 , H01L21/56 , H01L21/48 , H01L23/31 , H01L23/00
摘要： A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising five different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.
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公开(公告)号：US20180263118A1
公开(公告)日：2018-09-13
申请号：US15978268
申请日：2018-05-14
CPC分类号： H05K3/0041 , G06F3/041 , G06F2203/04102 , G06F2203/04103 , G06K9/00013 , H01L29/1606 , H05K1/0278 , H05K1/0306 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/144 , H05K3/0064 , H05K3/025 , H05K3/027 , H05K3/381 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0323 , H05K2201/042 , H05K2203/0152 , H05K2203/0376 , H05K2203/095 , H05K2203/1545
摘要： A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left there between.
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10.发明申请公开(公告)号：US20180102312A1
公开(公告)日：2018-04-12
申请号：US15286849
申请日：2016-10-06
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/563 , H01L23/3185 , H01L23/4985 , H01L23/49894 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/81 , H01L2224/1134 , H01L2224/1146 , H01L2224/13144 , H01L2224/16168 , H01L2224/81203 , H01L2224/8182
摘要： A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising five different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.
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