Invention Grant
- Patent Title: Anisotropic conductive film
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Application No.: US15515309Application Date: 2015-10-26
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Publication No.: US10513635B2Publication Date: 2019-12-24
- Inventor: Seiichiro Shinohara
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-223831 20141031
- International Application: PCT/JP2015/080127 WO 20151026
- International Announcement: WO2016/068083 WO 20160506
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C09J9/02 ; C09J7/00 ; H01B1/12 ; H01B1/20 ; C09J7/10 ; C08K9/02 ; H01L23/498

Abstract:
An anisotropic conductive film with a structure wherein an electrically insulating adhesive base layer and cover layer are stacked, and electrically conductive particles are disposed at lattice points with a planar lattice pattern in the vicinity of the interface of the layers. In the anisotropic conductive film, a proportion of lattice points at which no electrically conductive particles are disposed with respect to all lattice points with the planar lattice pattern assumed in any reference region is 25% or less, and some of the electrically conductive particles disposed at lattice points with planar lattice pattern are disposed to be shifted in longitudinal direction of anisotropic conductive film with respect to corresponding lattice points, and a shift amount defined as a distance between a plane projection center of the electrically conductive particles disposed to be shifted and the corresponding lattice point is less than 50% the electrically conductive particles' average diameter.
Public/Granted literature
- US20170226387A1 ANISOTROPIC CONDUCTIVE FILM Public/Granted day:2017-08-10
Information query
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