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    Method of producing anisotropic conductive film and anisotropic conductive film
    1.
    发明授权
    Method of producing anisotropic conductive film and anisotropic conductive film 有权

    公开(公告)号：US11034863B2

    公开(公告)日：2021-06-15

    申请号：US16369539

    申请日：2019-03-29

    Applicant: DEXERIALS CORPORATION

    Inventor： Seiichiro Shinohara ,  Yasushi Akutsu

    IPC: C09J7/10 ,  C09J5/06 ,  C09J9/02 ,  B29C35/08 ,  B29C43/00 ,  B29C43/20 ,  B29D7/01 ,  H01L23/00 ,  H05K3/32 ,  H01R4/04 ,  B29K63/00 ,  B29K505/00

    Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.

    Anisotropic conductive film and connected structure
    2.
    发明授权
    Anisotropic conductive film and connected structure 有权

    公开(公告)号：US10510711B2

    公开(公告)日：2019-12-17

    申请号：US16003310

    申请日：2018-06-08

    Applicant: DEXERIALS CORPORATION

    Inventor： Seiichiro Shinohara

    IPC: H01L23/00 ,  C09J9/02 ,  C08K3/08 ,  H05K3/32 ,  C09J7/20

    Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35□. These anisotropic conductive films have stable connection reliability in COG connection.

    Anisotropic conductive film and connection structure
    5.
    发明授权
    Anisotropic conductive film and connection structure 有权

    公开(公告)号：US10975267B2

    公开(公告)日：2021-04-13

    申请号：US15509359

    申请日：2015-10-02

    Applicant: DEXERIALS CORPORATION

    Inventor： Seiichiro Shinohara

    IPC: H01R13/24 ,  H01L23/00 ,  C09J7/10 ,  H01R11/01 ,  C09J11/04 ,  C08K3/08 ,  C09J9/02 ,  H01B1/22

    Abstract: An anisotropic conductive film including an electrically insulating adhesive layer, and electrically conductive particles disposed on the electrically insulating adhesive layer. In such an anisotropic conductive film, the electrically conductive particles are disposed in a lattice by being arranged in first direction rows and second direction rows, and narrow and wide intervals are provided between neighboring rows in at least one of the direction rows. As a result, opposing terminals are stably connected using the anisotropic conductive film, inspection after the connecting is more easily performed, and the number of electrically conductive particles not involved in the connection are reduced and, thereby, the manufacturing cost of the anisotropic conductive film is reduced, even in FOG connections or the like with finer bump pitches.

    Anisotropic conductive film and connection structure
    6.
    发明授权
    Anisotropic conductive film and connection structure 有权

    公开(公告)号：US10121756B2

    公开(公告)日：2018-11-06

    申请号：US15316649

    申请日：2015-05-08

    Applicant: DEXERIALS CORPORATION

    Inventor： Seiichiro Shinohara ,  Yasushi Akutsu

    IPC: H01L23/48 ,  H01L23/00 ,  H05K3/32

    Abstract: In order to easily inspect a dispersion state of conductive particles in such an anisotropic conductive film that the conductive particles are dispersed even at high density, linear lines including no conductive particle in a plan view of an anisotropic conductive film including an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer are allowed to exist at predetermined intervals. Specifically, the conductive particles are disposed in a lattice so as to be arranged in a first arrangement direction and a second arrangement direction, and the disappearance lines are inclined relative to the first arrangement direction or the second arrangement direction.

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