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公开(公告)号:US11034863B2
公开(公告)日:2021-06-15
申请号:US16369539
申请日:2019-03-29
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara , Yasushi Akutsu
IPC: C09J7/10 , C09J5/06 , C09J9/02 , B29C35/08 , B29C43/00 , B29C43/20 , B29D7/01 , H01L23/00 , H05K3/32 , H01R4/04 , B29K63/00 , B29K505/00
Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.
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公开(公告)号:US10510711B2
公开(公告)日:2019-12-17
申请号:US16003310
申请日:2018-06-08
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara
Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35□. These anisotropic conductive films have stable connection reliability in COG connection.
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公开(公告)号:US11901325B2
公开(公告)日:2024-02-13
申请号:US15543113
申请日:2016-01-13
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara , Yasushi Akutsu , Tomoyuki Ishimatsu
IPC: H01L23/498 , H01L23/48 , H01L23/00 , H01L25/065 , H01L25/00
CPC classification number: H01L24/27 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L24/32 , H01L2224/111 , H01L2224/11003 , H01L2224/131 , H01L2224/133 , H01L2224/1308 , H01L2224/1319 , H01L2224/1369 , H01L2224/13078 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13686 , H01L2224/1403 , H01L2224/16058 , H01L2224/16059 , H01L2224/16146 , H01L2224/16147 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/17107 , H01L2224/271 , H01L2224/27003 , H01L2224/27515 , H01L2224/2919 , H01L2224/2929 , H01L2224/29082 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81101 , H01L2224/81122 , H01L2224/81903 , H01L2224/83101 , H01L2224/83122 , H01L2224/83203 , H01L2224/83856 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06589 , H01L2924/00015 , H01L2924/3841 , H01L2924/00015 , H01L2224/83851 , H01L2224/9211 , H01L2224/81 , H01L2224/83 , H01L2224/83203 , H01L2924/00014 , H01L2224/131 , H01L2924/014 , H01L2224/81122 , H01L2924/00012 , H01L2224/83122 , H01L2924/00012 , H01L2224/271 , H01L2924/00012 , H01L2224/13155 , H01L2924/00014 , H01L2224/13157 , H01L2924/00014 , H01L2224/13139 , H01L2924/00014 , H01L2224/13147 , H01L2924/00014 , H01L2224/13144 , H01L2924/00014 , H01L2224/13164 , H01L2924/00014 , H01L2224/133 , H01L2924/00014 , H01L2224/2919 , H01L2924/0635 , H01L2224/2919 , H01L2924/0665 , H01L2224/2929 , H01L2924/0635 , H01L2224/2929 , H01L2924/0665 , H01L2224/29387 , H01L2924/05442 , H01L2224/29387 , H01L2924/05432 , H01L2224/29387 , H01L2924/00012 , H01L2224/1319 , H01L2924/00014 , H01L2224/111 , H01L2924/00012 , H01L2224/1369 , H01L2924/00014 , H01L2224/13686 , H01L2924/00014
Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.
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公开(公告)号:US11787976B2
公开(公告)日:2023-10-17
申请号:US17403072
申请日:2021-08-16
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara , Yasushi Akutsu
IPC: C09J7/10 , C09J5/06 , C09J9/02 , B29C35/08 , B29C43/00 , B29C43/20 , B29D7/01 , H01L23/00 , H05K3/32 , H01R4/04 , B29K63/00 , B29K505/00
CPC classification number: C09J7/10 , B29C35/0805 , B29C43/003 , B29C43/203 , B29D7/01 , C09J5/06 , C09J9/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , B29C2035/0827 , B29K2063/00 , B29K2505/00 , B29K2995/0005 , C09J2301/208 , C09J2301/314 , H01L2224/293 , H01L2224/2929 , H01L2224/29076 , H01L2224/29083 , H01L2224/29499 , H01R4/04 , H05K3/323 , Y10T428/24612
Abstract: A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.
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公开(公告)号:US10975267B2
公开(公告)日:2021-04-13
申请号:US15509359
申请日:2015-10-02
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara
Abstract: An anisotropic conductive film including an electrically insulating adhesive layer, and electrically conductive particles disposed on the electrically insulating adhesive layer. In such an anisotropic conductive film, the electrically conductive particles are disposed in a lattice by being arranged in first direction rows and second direction rows, and narrow and wide intervals are provided between neighboring rows in at least one of the direction rows. As a result, opposing terminals are stably connected using the anisotropic conductive film, inspection after the connecting is more easily performed, and the number of electrically conductive particles not involved in the connection are reduced and, thereby, the manufacturing cost of the anisotropic conductive film is reduced, even in FOG connections or the like with finer bump pitches.
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公开(公告)号:US10121756B2
公开(公告)日:2018-11-06
申请号:US15316649
申请日:2015-05-08
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara , Yasushi Akutsu
Abstract: In order to easily inspect a dispersion state of conductive particles in such an anisotropic conductive film that the conductive particles are dispersed even at high density, linear lines including no conductive particle in a plan view of an anisotropic conductive film including an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer are allowed to exist at predetermined intervals. Specifically, the conductive particles are disposed in a lattice so as to be arranged in a first arrangement direction and a second arrangement direction, and the disappearance lines are inclined relative to the first arrangement direction or the second arrangement direction.
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公开(公告)号:US11923335B2
公开(公告)日:2024-03-05
申请号:US17472883
申请日:2021-09-13
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara
CPC classification number: H01L24/83 , C09J7/20 , C09J9/02 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/92 , C08K3/08 , C08K2201/001 , C09J2203/326 , C09J2301/314 , C09J2301/408 , C09J2463/00 , C09J2467/006 , H01L24/13 , H01L24/16 , H01L2224/13144 , H01L2224/271 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29387 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83203 , H01L2224/83851 , H01L2224/9211 , H05K3/323 , H01L2224/29355 , H01L2924/00014 , H01L2224/29357 , H01L2924/00014 , H01L2224/29339 , H01L2924/00014 , H01L2224/29347 , H01L2924/00014 , H01L2224/29344 , H01L2924/00014 , H01L2224/29364 , H01L2924/00014 , H01L2224/294 , H01L2924/00014 , H01L2224/2939 , H01L2924/00014 , H01L2224/2929 , H01L2924/0635 , H01L2224/2929 , H01L2924/0665 , H01L2224/29387 , H01L2924/05442 , H01L2224/29387 , H01L2924/05432 , H01L2224/29387 , H01L2924/05432 , H01L2924/01001 , H01L2224/271 , H01L2924/00012 , H01L2224/83203 , H01L2924/00012 , H01L2224/83101 , H01L2924/00012 , H01L2224/13144 , H01L2924/00014 , H01L2224/9211 , H01L2224/81 , H01L2224/83
Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.
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公开(公告)号:US11710716B2
公开(公告)日:2023-07-25
申请号:US17738655
申请日:2022-05-06
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara
IPC: B32B37/06 , B32B37/10 , B32B37/24 , B32B38/00 , C08G59/68 , H01L23/00 , H05K3/32 , C09J4/00 , H05K1/03 , B32B3/26 , B32B37/00
CPC classification number: H01L24/29 , B32B3/263 , B32B37/025 , B32B37/06 , B32B37/10 , B32B37/24 , B32B38/0008 , C08G59/68 , H01L24/27 , H01L24/83 , H05K3/323 , B32B2037/243 , B32B2305/30 , B32B2307/202 , B32B2457/00 , C09J4/00 , H01L2224/27003 , H01L2224/27005 , H01L2224/294 , H01L2224/2919 , H01L2224/2929 , H01L2224/2939 , H01L2224/29076 , H01L2224/29082 , H01L2224/29083 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29499 , H01L2224/83851 , H01L2924/12042 , H01L2924/15788 , H01L2924/181 , H05K1/0373 , H05K2201/0215 , Y10T428/24521 , H01L2224/29339 , H01L2924/00014 , H01L2224/29357 , H01L2924/00014 , H01L2224/29355 , H01L2924/00014 , H01L2224/29347 , H01L2924/00014 , H01L2224/29344 , H01L2924/00014 , H01L2224/29364 , H01L2924/00014 , H01L2224/2939 , H01L2924/00014 , H01L2224/294 , H01L2924/00014 , H01L2224/83851 , H01L2924/00014 , H01L2924/15788 , H01L2924/00 , H01L2924/181 , H01L2924/00 , H01L2924/12042 , H01L2924/00
Abstract: An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.
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公开(公告)号:US11348891B2
公开(公告)日:2022-05-31
申请号:US16694212
申请日:2019-11-25
Applicant: DEXERIALS CORPORATION
Inventor: Seiichiro Shinohara
IPC: H01L23/00 , B32B3/26 , B32B37/00 , B32B37/06 , B32B37/10 , B32B37/24 , B32B38/00 , C08G59/68 , H05K3/32 , C09J4/00 , H05K1/03
Abstract: An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.
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公开(公告)号:US11135807B2
公开(公告)日:2021-10-05
申请号:US16463856
申请日:2017-11-20
Applicant: DEXERIALS CORPORATION
Inventor: Reiji Tsukao , Shinichi Hayashi , Seiichiro Shinohara , Yusuke Tanaka
IPC: B32B7/02 , C08L35/02 , C08J5/18 , H01F27/32 , H01R11/01 , H01R43/00 , B32B27/20 , B32B27/30 , B32B27/42 , C08L61/06
Abstract: A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.
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