Invention Grant
- Patent Title: Coil electronic component with distance between lead portion and coil pattern greater than distance between adjacent coil patterns
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Application No.: US15082539Application Date: 2016-03-28
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Publication No.: US10515750B2Publication Date: 2019-12-24
- Inventor: Dong Jin Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0075952 20150529
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/29

Abstract:
A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region. A distance between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance between adjacent patterns of the coil pattern.
Public/Granted literature
- US20160351319A1 COIL ELECTRONIC COMPONENT Public/Granted day:2016-12-01
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |