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    Chip electronic component and board having the same
    1.
    发明授权
    Chip electronic component and board having the same 有权

    公开(公告)号：US11469030B2

    公开(公告)日：2022-10-11

    申请号：US16730399

    申请日：2019-12-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin Jeong

    IPC: H01F5/00 ,  H01F17/00 ,  H01F17/06 ,  H01F27/29 ,  H01F17/04

    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

    Coil electronic component and method of manufacturing same
    2.
    发明授权
    Coil electronic component and method of manufacturing same 有权

    公开(公告)号：US10734155B2

    公开(公告)日：2020-08-04

    申请号：US15955464

    申请日：2018-04-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin Jeong

    IPC: H01F27/32 ,  H01F27/28 ,  H01F27/255 ,  H01F27/29 ,  H01F41/04 ,  H01F41/02

    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.

    Coil electronic component and method of manufacturing same
    4.
    发明授权
    Coil electronic component and method of manufacturing same 有权

    公开(公告)号：US09978501B2

    公开(公告)日：2018-05-22

    申请号：US15098938

    申请日：2016-04-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin Jeong

    IPC: H01F5/00 ,  H01F27/28 ,  H01F27/255 ,  H01F27/29 ,  H01F41/04 ,  H01F41/02

    CPC classification number: H01F27/2804 ,  H01F27/255 ,  H01F27/29 ,  H01F41/0233 ,  H01F41/042

    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.

    Chip electronic component and board having the same
    6.
    发明授权
    Chip electronic component and board having the same 有权

    公开(公告)号：US11626233B2

    公开(公告)日：2023-04-11

    申请号：US16992329

    申请日：2020-08-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin Jeong

    IPC: H01F17/00 ,  H01F27/29 ,  H01F17/04 ,  H01F17/06

    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

    Coil component
    8.
    发明授权
    Coil component 有权

    公开(公告)号：US10580563B2

    公开(公告)日：2020-03-03

    申请号：US15183099

    申请日：2016-06-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin Jeong

    IPC: H01F5/00 ,  H01F27/255 ,  H01F1/36 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F1/26

    Abstract: A coil component includes: a coil part; and a body formed around the coil part and containing a magnetic material. The body contains a first magnetic powder particle having a first insulating film formed on a surface thereof, and a second magnetic powder particle having a second insulating film formed on a surface thereof, and an average thickness of the first insulating film is thicker than that of the second insulating film.

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