Invention Grant
- Patent Title: Fan-out package structure having stacked carrier substrates and method for forming the same
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Application No.: US15700220Application Date: 2017-09-11
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Publication No.: US10515887B2Publication Date: 2019-12-24
- Inventor: Shih-Yi Syu , Chia-Yu Jin , Che-Ya Chou , Wen-Sung Hsu , Nan-Cheng Chen
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/065 ; H01L21/56 ; H01L23/31 ; H01L23/42 ; H01L23/64 ; H01L23/367 ; H01L23/433 ; H01L21/48 ; H01L23/00
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a first carrier substrate having a first surface and an opposing second surface. A second carrier substrate is stacked on the first carrier substrate and has a first surface and an opposing second surface that faces the first surface of the first carrier substrate. A semiconductor die is mounted on the first surface of the second carrier substrate. A heat spreader is disposed on the first surface of the first carrier substrate to cover and surround the second carrier substrate and the semiconductor die. A method for forming the semiconductor package structure is also provided.
Public/Granted literature
- US20180082936A1 FAN-OUT PACKAGE STRUCTURE HAVING STACKED CARRIER SUBSTRATES AND METHOD FOR FORMING THE SAME Public/Granted day:2018-03-22
Information query
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