公开(公告)号：US20230039444A1

公开(公告)日：2023-02-09

申请号：US17965787

申请日：2022-10-14

Applicant: MEDIATEK INC.

Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

IPC: H01Q1/22 ,  H01L23/498 ,  H01Q21/06 ,  H01L25/16

Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is disposed on the second side.

公开(公告)号：US10515887B2

公开(公告)日：2019-12-24

申请号：US15700220

申请日：2017-09-11

Applicant: MEDIATEK INC.

Inventor： Shih-Yi Syu ,  Chia-Yu Jin ,  Che-Ya Chou ,  Wen-Sung Hsu ,  Nan-Cheng Chen

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L23/42 ,  H01L23/64 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first carrier substrate having a first surface and an opposing second surface. A second carrier substrate is stacked on the first carrier substrate and has a first surface and an opposing second surface that faces the first surface of the first carrier substrate. A semiconductor die is mounted on the first surface of the second carrier substrate. A heat spreader is disposed on the first surface of the first carrier substrate to cover and surround the second carrier substrate and the semiconductor die. A method for forming the semiconductor package structure is also provided.

公开(公告)号：US20200303806A1

公开(公告)日：2020-09-24

申请号：US16867583

申请日：2020-05-06

Applicant: MEDIATEK INC.

Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

IPC: H01Q1/22 ,  H01L23/498 ,  H01L25/16 ,  H01Q21/06

Abstract: A semiconductor package includes a bottom chip package having a first side and a second side opposing the first side. The bottom chip package comprises a first semiconductor chip and a second semiconductor chip arranged in a side-by-side manner on the second side. A top antenna package is mounted on the first side of the bottom chip package. The top antenna package comprises a radiative antenna element. A connector is disposed on the second side.

公开(公告)号：US20250015483A1

公开(公告)日：2025-01-09

申请号：US18885764

申请日：2024-09-16

Applicant: MEDIATEK INC.

Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

IPC: H01Q1/22 ,  H01L23/498 ,  H01L25/16 ,  H01Q21/06

Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is configured to electrically couple to a 5G modem through a flex cable and is disposed on the second side.

公开(公告)号：US12095142B2

公开(公告)日：2024-09-17

申请号：US17965787

申请日：2022-10-14

Applicant: MEDIATEK INC.

Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

IPC: H01Q1/22 ,  H01L23/498 ,  H01L25/16 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/16 ,  H01Q21/06

Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is disposed on the second side.

公开(公告)号：US11509038B2

公开(公告)日：2022-11-22

申请号：US16867583

申请日：2020-05-06

Applicant: MEDIATEK INC.

Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

IPC: H01Q1/22 ,  H01L23/498 ,  H01Q21/06 ,  H01L25/16

Abstract: A semiconductor package includes a bottom chip package having a first side and a second side opposing the first side. The bottom chip package comprises a first semiconductor chip and a second semiconductor chip arranged in a side-by-side manner on the second side. A top antenna package is mounted on the first side of the bottom chip package. The top antenna package comprises a radiative antenna element. A connector is disposed on the second side.