Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15986426Application Date: 2018-05-22
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Publication No.: US10516056B2Publication Date: 2019-12-24
- Inventor: I-Sheng Chen , Chih Chieh Yeh , Cheng-Hsien Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/306 ; H01L21/8238 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L27/092 ; H01L29/06 ; H01L29/16 ; H01L29/161 ; H01L29/165 ; H01L29/267 ; H01L29/08

Abstract:
A semiconductor device includes channel layers disposed over a substrate, a source/drain region disposed over the substrate, a gate dielectric layer disposed on and wrapping each of the channel layers, and a gate electrode layer disposed on the gate dielectric layer and wrapping each of the channel layers. Each of the channel layers includes a semiconductor wire made of a first semiconductor material. The semiconductor wire extends into the source/drain region. The semiconductor wire in the source/drain regions is wrapped around by a second semiconductor material.
Public/Granted literature
- US20180350999A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-12-06
Information query
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