Invention Grant
- Patent Title: Interface substrate and method of making the same
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Application No.: US15256501Application Date: 2016-09-02
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Publication No.: US10516092B2Publication Date: 2019-12-24
- Inventor: Jon Gregory Aday , Hong Bok We , Steve Joseph Bezuk , Nicholas Ian Buchan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe
- Main IPC: H01L27/20
- IPC: H01L27/20 ; H01L41/113 ; H01L23/31 ; H01L23/00 ; H01L23/498 ; H01L21/78 ; H01L21/56 ; H01L21/768 ; H01L41/053
Abstract:
A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.
Public/Granted literature
- US20170323926A1 INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME Public/Granted day:2017-11-09
Information query
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