公开(公告)号：US20170364726A1

公开(公告)日：2017-12-21

申请号：US15430389

申请日：2017-02-10

Applicant: QUALCOMM Incorporated

Inventor： Nicholas Ian Buchan ,  Mario Francisco Velez ,  Chin-Jen Tseng ,  Hrishikesh Vijaykumar Panchawagh ,  Firas Sammoura ,  Jessica Liu Strohmann ,  Kostadin Dimitrov Djordjev ,  David Williams Burns ,  Leonard Eugene Fennell ,  Jon Gregory Aday

IPC: G06K9/00 ,  H01L41/107 ,  H01L41/047 ,  G02F1/1333 ,  H01L27/32

CPC classification number: G06K9/0002 ,  G01N29/22 ,  G01N29/2437 ,  G02F1/13338 ,  H01L27/323 ,  H01L41/047 ,  H01L41/107

Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.

公开(公告)号：US10516092B2

公开(公告)日：2019-12-24

申请号：US15256501

申请日：2016-09-02

Applicant: QUALCOMM Incorporated

Inventor： Jon Gregory Aday ,  Hong Bok We ,  Steve Joseph Bezuk ,  Nicholas Ian Buchan

IPC: H01L27/20 ,  H01L41/113 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/78 ,  H01L21/56 ,  H01L21/768 ,  H01L41/053

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

公开(公告)号：US11003884B2

公开(公告)日：2021-05-11

申请号：US15430389

申请日：2017-02-10

Applicant: QUALCOMM Incorporated

Inventor： Nicholas Ian Buchan ,  Mario Francisco Velez ,  Chin-Jen Tseng ,  Hrishikesh Vijaykumar Panchawagh ,  Firas Sammoura ,  Jessica Liu Strohmann ,  Kostadin Dimitrov Djordjev ,  David William Burns ,  Leonard Eugene Fennell ,  Jon Gregory Aday

IPC: G06K9/00 ,  G01N29/22 ,  G01N29/24 ,  H01L41/047 ,  H01L41/107 ,  G02F1/1333 ,  H01L27/32

Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.