Invention Grant
- Patent Title: Laser machining apparatus
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Application No.: US15001447Application Date: 2016-01-20
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Publication No.: US10532430B2Publication Date: 2020-01-14
- Inventor: Takashi Sampei
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain Ltd.
- Priority: JP2015-009273 20150121
- Main IPC: B23K26/402
- IPC: B23K26/402

Abstract:
A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb−ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.
Public/Granted literature
- US20160207145A1 LASER MACHINING APPARATUS Public/Granted day:2016-07-21
Information query
IPC分类: