- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US15844415Application Date: 2017-12-15
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Publication No.: US10535612B2Publication Date: 2020-01-14
- Inventor: Yi Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/498 ; H01L23/31 ; H01L25/16 ; H01L21/56 ; H01L21/48 ; H01L23/00

Abstract:
A semiconductor device package includes a substrate, a first electronic component, a first package body, an electrical contact and a first conductive layer. The substrate has a first surface, a second surface and a lateral surface extending between the first surface and the second surface. The first electronic component is disposed on the first surface of the substrate. The first package body encapsulates the first electronic component. The electrical contact is disposed on the second surface of the substrate. The first conductive layer includes a first portion and a second portion. The first portion is disposed on the first package body and the lateral surface of the substrate. The second portion contacts the electrical contact.
Public/Granted literature
- US20190189565A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-06-20
Information query
IPC分类: