A process for fabricating a printed circuit assembly is presented. The process includes providing a first base substrate having a first surface and a second surface opposite to the first surface; providing a flexible circuit layer including a first region having a first set of signal traces and a second region having a second set of signal traces, wherein the first region and the second region are separated by a first intermediate region; disposing the first region of the flexible circuit layer on the first surface of the first base substrate; bending the flexible circuit layer at the first intermediate region to surround a thickness side of the first base substrate; and disposing the second region of the flexible circuit layer on the second surface of the first base substrate. A printed circuit assembly is also presented.