Invention Grant
- Patent Title: Processing slice data
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Application No.: US15111127Application Date: 2014-07-31
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Publication No.: US10538074B2Publication Date: 2020-01-21
- Inventor: Sebastia Cortes , Alejandro Manuel De Pena , Josep Giralt
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Priority: WOPCT/EP2014/050841 20140116; WOPCT/EP2014/058822 20140430
- International Application: PCT/EP2014/066546 WO 20140731
- International Announcement: WO2015/106840 WO 20150723
- Main IPC: B33Y50/02
- IPC: B33Y50/02 ; B29K105/00

Abstract:
A system is provided for processing slice data representing a slice of a three-dimensional object to be generated by an additive manufacturing system. The system includes a processor to perform, when the additive manufacturing system is to generate the slice, a transformation on the slice data based on characteristic data of the additive manufacturing system, the slice data derived from three-dimensional object design data.
Public/Granted literature
- US20160349724A1 PROCESSING SLICE DATA Public/Granted day:2016-12-01
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