Invention Grant
- Patent Title: Housing assembly and cover applied to electronic device
-
Application No.: US16031479Application Date: 2018-07-10
-
Publication No.: US10539982B2Publication Date: 2020-01-21
- Inventor: Chih-Kuang Lin , Szu-Tang Chiu , Wai-Tong Chan , Sin-Fei Lai
- Applicant: ASUSTEK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTEK COMPUTER INC.
- Current Assignee: ASUSTEK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201810518535 20180525
- Main IPC: H05K5/03
- IPC: H05K5/03 ; G06F1/16 ; A45C11/00 ; H05K5/02
Abstract:
The present disclosure provides a housing assembly, and the housing assembly is applied to an electronic device. The housing assembly includes a first part and a second part. The first part includes at least one opening. The second part includes at least one mesh area. The mesh area deformably connects to the first part, and covers the opening.
Public/Granted literature
- US20190018455A1 HOUSING ASSEMBLY AND COVER APPLIED TO ELECTRONIC DEVICE Public/Granted day:2019-01-17
Information query
