Invention Grant
- Patent Title: Mold for forming a foam pad with intersecting ridges
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Application No.: US15460656Application Date: 2017-03-16
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Publication No.: US10543628B2Publication Date: 2020-01-28
- Inventor: Koji Mori , Yushi Sakakibara , Masamitsu Kondo , Motokazu Yoshii
- Applicant: Sekisui Plastics Co., Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sekisui Plastics Co., Ltd.
- Current Assignee: Sekisui Plastics Co., Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Locke Lord LLP
- Priority: JP2010-194373 20100831; JP2010-194443 20100831
- Main IPC: B29C44/58
- IPC: B29C44/58 ; B29C44/34 ; B60N3/04 ; B29C44/44 ; B29L31/30

Abstract:
A molded foam is provided in which even when a force in a sliding direction is applied to another member in contact with its surface, the occurrence of a shift in position relative to the other member can effectively be prevented and the occurrence of unusual noise due to rubbing between its surface and the other member can effectively be prevented. The molded foam is formed by heating expandable resin particles filled into a foaming mold. The molded foam has a plurality of first ridges arranged in one direction and a plurality of second ridges arranged in another direction and disposed so as to intersect the first ridges, the first and second ridges being provided on the surface of the molded foam.
Public/Granted literature
- US20170182687A1 MOLDED FOAM Public/Granted day:2017-06-29
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