Invention Grant
- Patent Title: Nickel lanthanide alloys for mems packaging applications
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Application No.: US16042595Application Date: 2018-07-23
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Publication No.: US10544034B1Publication Date: 2020-01-28
- Inventor: Nazila Dadvand , Kathryn Schuck
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L29/40 ; B81B7/00 ; B81C1/00 ; H01L23/00
Abstract:
A semiconductor package including a semiconductor die and at least one bondline positioned on the semiconductor die, the at least one bondline comprising a nickel lanthanide alloy diffusion barrier layer abutting a gold layer.
Public/Granted literature
- US20200024130A1 NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS Public/Granted day:2020-01-23
Information query
IPC分类:
