Invention Grant
- Patent Title: Lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
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Application No.: US16076743Application Date: 2017-02-07
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Publication No.: US10545410B2Publication Date: 2020-01-28
- Inventor: Hakki Ergun Cekli , Masashi Ishibashi , Leon Paul Van Dijk , Richard Johannes Franciscus Van Haren , Xing Lan Liu , Reiner Maria Jungblut , Cedric Marc Affentauschegg , Ronald Henricus Johannes Otten
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Priority: EP16156361 20160218; EP17152954 20170125
- International Application: PCT/EP2017/052639 WO 20170207
- International Announcement: WO2014/140532 WO 20170824
- Main IPC: G03B27/42
- IPC: G03B27/42 ; G03F7/20 ; G03F9/00

Abstract:
A lithographic process includes clamping a substrate onto a substrate support, measuring positions across the clamped substrate, and applying a pattern to the clamped substrate using the positions measured. A correction is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic in the positions measured across the substrate. The correction may be generated by inferring one or more shape characteristics of the warped substrate using the measured positions and other information. Based on the one or more inferred shape characteristics, a clamping model is applied to simulate deformation of the warped substrate in response to clamping. A correction is calculated based on the simulated deformation.
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