A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.