- Patent Title: Anisotropic electrically conductive film and connection structure
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Application No.: US15576759Application Date: 2016-05-27
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Publication No.: US10546831B2Publication Date: 2020-01-28
- Inventor: Seiichiro Shinohara
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-120627 20150527; JP2015-108662 20150528
- International Application: PCT/JP2016/065802 WO 20160527
- International Announcement: WO2016/190432 WO 20161201
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
An anisotropic electrically conductive film includes electrically conductive particles disposed in an electrically insulating adhesive layer. The particles are arranged at a predetermined pitch along first axes, arranged side by side, and are substantially spherical. The particle pitch at the first axes and the axis pitch of the first axes are both greater than or equal to 1.5D, D being an average particle diameter of the particles. Directions of all sides of a triangle formed by a particle (P0), which is one of the electrically conductive particles at one of the first axes, an electrically conductive particle (P1), which is at the one of the first axes and adjacent to the particle (P0), and an electrically conductive particle (P2), which is at another one of the first axes that is adjacent to the one of the first axes, are oblique to a film width direction of the conductive film.
Public/Granted literature
- US20180301432A1 Anisotropic Electrically Conductive Film and Connection Structure Public/Granted day:2018-10-18
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