Invention Grant
- Patent Title: Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
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Application No.: US15777040Application Date: 2015-12-22
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Publication No.: US10546835B2Publication Date: 2020-01-28
- Inventor: Vijay K. Nair , Georgios C. Dogiamis , Telesphor Kamgaing
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2015/000159 WO 20151222
- International Announcement: WO2017/111768 WO 20170629
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/66 ; H01L25/10 ; H01L23/00
Abstract:
Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.
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Information query
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