Invention Grant
- Patent Title: Manufacturing method of semiconductor device
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Application No.: US15907343Application Date: 2018-02-28
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Publication No.: US10546958B2Publication Date: 2020-01-28
- Inventor: Yuta Endo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2015-096317 20150511
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/24 ; H01L29/66 ; H01L29/78 ; H01L21/8258 ; H01L27/06 ; H01L27/12

Abstract:
A miniaturized transistor with less variation and highly stable electrical characteristics is provided. Further, high performance and high reliability of a semiconductor device including the transistor are achieved. A semiconductor and a conductor are formed over a substrate, a sacrificial layer is formed over the conductor, and an insulator is formed to cover the sacrificial layer. After that, a top surface of the insulator is removed to expose a top surface of the sacrificial layer. The sacrificial layer and a region of the conductor overlapping with the sacrificial layer are removed, whereby a source region, a drain region, and an opening are formed. Next, a gate insulator and a gate electrode are formed in the opening.
Public/Granted literature
- US20180190826A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2018-07-05
Information query
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