Invention Grant
- Patent Title: Air and fluid cooling of a data center
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Application No.: US15329246Application Date: 2014-07-31
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Publication No.: US10548242B2Publication Date: 2020-01-28
- Inventor: Tahir Cader , Wade D Vinson , Douglas Kent Garday , John P Franz
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2014/049320 WO 20140731
- International Announcement: WO2016/018423 WO 20160204
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K7/14

Abstract:
A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.
Public/Granted literature
- US20170231118A1 AIR AND FLUID COOLING OF A DATA CENTER Public/Granted day:2017-08-10
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