Invention Grant
- Patent Title: Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor
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Application No.: US15884624Application Date: 2018-01-31
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Publication No.: US10549982B2Publication Date: 2020-02-04
- Inventor: Enri Duqi , Bruno Murari , Sebastiano Conti
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: IT102016000015081 20160215
- Main IPC: H01L29/82
- IPC: H01L29/82 ; B81B3/00 ; B81B7/00
Abstract:
A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
Public/Granted literature
- US20180148316A1 PRESSURE SENSOR ENCAPSULATED IN ELASTOMERIC MATERIAL, AND SYSTEM INCLUDING THE PRESSURE SENSOR Public/Granted day:2018-05-31
Information query
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