According to one embodiment, a first substrate includes a first area, a second area, a third area, a fourth area and a fifth area in a planar view. In the first substrate, an organic insulating film is present in the second and the third areas, is present neither in the third area nor in the fifth area, and forms an adjustment area. A conductive film is provided on the organic insulating film, the third area, the fourth area and a part of the fifth area. A sealing material is present in a part of the second area, the third area, the fourth area and a part of the fifth area to attach the first substrate and a second substrate. A through hole penetrates the first and the second substrates.