- Patent Title: Method of forming a directed self-assembled layer on a substrate
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Application No.: US16094119Application Date: 2017-04-07
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Publication No.: US10551741B2Publication Date: 2020-02-04
- Inventor: Werner Knaepen , Jan Willem Maes , Maarten Stokhof , Roel Gronheid , Hari Pathangi Sriraman
- Applicant: ASM IP HOLDING B.V. , IMEC VZW
- Applicant Address: NL Almere BE Leuven
- Assignee: ASM IP HOLDING B.V.,IMEC vzw
- Current Assignee: ASM IP HOLDING B.V.,IMEC vzw
- Current Assignee Address: NL Almere BE Leuven
- Agency: Knobbe Martens Olson & Bear, LLP
- International Application: PCT/US2017/026518 WO 20170407
- International Announcement: WO2017/184357 WO 20171026
- Main IPC: G03F7/16
- IPC: G03F7/16 ; H01L21/027 ; H01L21/67 ; H01L21/768 ; H01L51/00 ; H01L21/469 ; H01L21/31 ; B05D3/04 ; B05D3/02
Abstract:
A method of forming a directed self-assembled (DSA) layer on a substrate by: providing a substrate; applying a layer comprising a self-assembly material on the substrate; and annealing of the self-assembly material of the layer to form a directed self-assembled layer by providing a controlled temperature and gas environment around the substrate. The controlled gas environment comprises molecules comprising an oxygen element with a partial pressure between 10-2000 Pa.
Public/Granted literature
- US20190155159A1 METHOD OF FORMING A DIRECTED SELF-ASSEMBLED LAYER ON A SUBSTRATE Public/Granted day:2019-05-23
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